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1 isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158 e 16.5kv esd, large output swing, 5v, full fail-safe, 1/8 unit load, rs-485/rs-422 transceivers isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e the isl315xe are iec61000 esd protected, 5v powered transceivers that meet the rs-485 and rs-422 standards for balanced communication. driver outputs and receiver inputs are pr otected against 16.5kv esd strikes without latch-up. transmitters in this family deliver exceptional differential output voltages (2.4v min), into the rs-485 required 54 load, for better noise immunity, or to allow up to eight 120 terminations in ?star? topologies. these devices have very low bus currents so they present a true ?1/8 unit load? to the rs-485 bus. this allows up to 256 transceivers on the network without using repeaters. receiver (rx) inputs feature a ?full fail-safe? design, which ensures a logic high rx output if rx inputs are floating, shorted, or on a terminated but undriven bus. rx outputs feature high drive levels - typically 28ma @ v ol = 1v (to ease the design of optocoupled isolated interfaces). half duplex (rx inputs and tx outputs multiplexed together) and full duplex pinouts are available. see table 1 on page 2 for key features and configurations by device number. features ?high driver v od . . . . . . . 2.4v (min) @ r d = 54 better noise immunity, or drive up to 8 terminations ? 16.5kv iec61000 esd protection on i/o bus pins ? high transient overvoltage tolerance . . . . 100v ? full fail-safe (open, short, terminated) receivers ?high rx i ol for opto-couplers in isolated designs ? hot plug circuitry - tx and rx outputs remain three-state during power-up/power-down ? true 1/8 unit load for up to 256 devices on the bus ? high data rates . . . . . . . . . . . . . . up to 20mbps ? low quiescent supply current . . . . . . . . . 600 a ultra low shutdown supply current . . . . . . 70na applications* (see page 17) ? utility meters/automated meter reading systems ? high node count systems ? profibus? and field bus networks, and factory automation ? security camera networks ? building lighting and environmental control systems ? industrial/process control networks exceptional tx drives up to 8 terminations while still delivering 1.5v v od large v od delivers superior signal at cable end for enhanced noise immunity differential output voltage (v) driver output current (ma) 012345 0 10 40 60 80 100 120 140 30 50 70 90 110 130 20 8 terms 6 terms 2 terms 1 term 1.5 20ns/div -3 -1 0 1 3 -2 2 output voltage (v) 20mbps, 150? utp, double 120 terms isl3158e standard 1.5v tx caution: these devices are sensitive to electrostatic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | intersil (and design) is a registered trademark of intersil americas inc. copyright ? intersil americas inc. 2006-2009 all rights reserved all other trademarks mentioned are the property of their respective owners. july 30, 2009 fn6363.2
2 fn6363.2 july 30, 2009 table 1. summary of features part number half/full duplex data rate (mbps) slew- rate limited? hot plug # devices on bus rx/tx enable? quiescent i cc (a) low power shutdown? pin count isl3150e full 0.115 yes yes 256 yes 600 yes 10, 14 isl3152e half 0.115 yes yes 256 yes 600 yes 8 isl3153e full 1 yes yes 256 yes 600 yes 10, 14 isl3155e half 1 yes yes 256 yes 600 yes 8 isl3156e full 20 no yes 256 yes 600 yes 10, 14 isl3158e half 20 no yes 256 yes 600 yes 8 ordering information part number part marking temp. range (c) package (pb-free) pkg. dwg. # isl3150eibz (notes 1, 3) 3150eibz -40 to +85 14 ld soic m14.15 isl3150eiuz (notes 1, 3) 3150z -40 to +85 10 ld msop m10.118 isl3152eibz (notes 1, 3) 3152eibz -40 to +85 8 ld soic m8.15 isl3152eipz (notes 2, 3) isl3152 eipz -40 to +85 8 ld pdip e8.3 isl3152eiuz (notes 1, 3) 3152z -40 to +85 8 ld msop m8.118 isl3153eibz (notes 1, 3) 3153eibz -40 to +85 14 ld soic m14.15 isl3153eiuz (notes 1, 3) 3153z -40 to +85 10 ld msop m10.118 isl3155eibz (notes 1, 3) 3155eibz -40 to +85 8 ld soic m8.15 isl3155eiuz (notes 1, 3) 3155z -40 to +85 8 ld msop m8.118 ISL3156EIBZ (notes 1, 3) 3156eibz -40 to +85 14 ld soic m14.15 isl3156eiuz (notes 1, 3) 3156z -40 to +85 10 ld msop m10.118 isl3158eibz (notes 1, 3) 3158eibz -40 to +85 8 ld soic m8.15 isl3158eiuz (notes 1, 3) 3158z -40 to +85 8 ld msop m8.118 1. add ?-t? suffix for tape and reel. please refe r to tb347 for details on reel specifications. 2. pb-free pdips can be used for through-hole wave solder processing only. they are not intended for use in reflow solder processing applications. 3. these intersil pb-free plastic packaged products employ special pb-free material sets, molding compounds/die attach materials, and 100% matt e tin plate plus anneal (e3 termin ation finish, which is rohs comp liant and compatible with both snpb and pb-free soldering operations). inte rsil pb-free products are msl classified at pb-free peak reflow temperatures that meet or exceed the pb-free requirements of ipc/jedec j std-020. 4. for moisture sensitivity level (msl), please see device information pages for isl3150e , isl3152e , isl3153e , isl3155e , isl3156e and isl3158e . for more information on msl please see techbrief tb363 . pin configurations isl3152e, isl3155e, isl3158e (8 ld msop, 8 ld soic, 8 ld pdip) top view isl3150e, isl3153e, isl3156e (10 ld msop) top view isl3150e, isl3153e, isl3156e (14 ld soic) top view ro re de di 1 2 3 4 8 7 6 5 v cc b/z a/y gnd d r ro re de di gnd v cc a b z y 1 2 3 4 5 10 9 8 7 6 d r nc ro re de di gnd gnd v cc nc a b z y nc 1 2 3 4 5 6 7 14 13 12 11 10 9 8 d r isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
3 fn6363.2 july 30, 2009 pin descriptions pin function ro receiver output: if a-b -50mv, ro is high; if a-b -200mv, ro is low; ro = high if a and b are unconnected (floating) or shorted. re receiver output enable. ro is enabled when re is low; ro is high impedance when re is high. de driver output enable. the driver outp uts, y and z, are enabled by bringing de high. they are high impedance when de is low. di driver input. a low on di forces outp ut y low and output z high. similarly, a high on di forces output y high and output z low. gnd ground connection. a/y 16.5kv iec61000 esd protected rs-485/rs-422 level, no n-inverting receiver input and non inverting driver output. pin is an input if de = 0; pin is an output if de = 1. b/z 16.5kv iec61000 esd protected rs-485/rs-422 level, inverting receiver input and inverting driver output. pin is an input if de = 0; pin is an output if de = 1. a 16.5kv iec61000 esd protected rs-485/rs-422 level, non-inverting receiver input. b 16.5kv iec61000 esd protected rs-485/rs-422 level, inverting receiver input. y 16.5kv iec61000 esd protected rs-485/rs-422 level, non-inverting driver output. z 16.5kv iec61000 esd protected rs-485/rs-422 level, inverting driver output. v cc system power supply input (4.5v to 5.5v). nc no connection. truth tables transmitting inputs outputs re de di z y x1101 x1010 0 0 x high-z high-z 10xhigh-z*high-z* note: *shutdown mode (see note 11). receiving inputs output re de half duplex de full duplex a-b ro 00 x -0.05v 1 00 x -0.2v 0 0 0 x inputs open/shorted 1 10 0 xhigh-z* 11 1 xhigh-z note: *shutdown mode (see note 11). isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
4 fn6363.2 july 30, 2009 typical operating circuit isl3152e, isl3155e, isl3158e isl3150e, isl3153e, isl3156e (soic pin numbers shown) 0.1f + d r 7 6 8 1 2 3 4 5 v cc gnd ro re de di a/y b/z +5v 0.1f + d r 6 7 8 1 2 3 4 5 v cc gnd ro re de di a/y b/z +5v r t r t 0.1f + d r 12 11 10 9 14 2 3 4 5 6, 7 v cc gnd ro re de di a b y z +5v 0.1f + d r 12 11 10 9 14 2 3 4 5 6, 7 v cc gnd ro re de di a b y z +5v r t r t isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
5 fn6363.2 july 30, 2009 absolute maximum ratings thermal information v cc to ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7v input voltages di, de, re . . . . . . . . . . . . . . . . -0.3v to (v cc + 0.3v) input/output voltages a/y, b/z, a, b, y, z . . . . . . . . . . . . . . . . . -9v to +13v a/y, b/z, a, b, y, z (transient pulse through 100 , note 16) . . . . . . . . . . . . . . . . . . . . . . . . . . . 100v ro . . . . . . . . . . . . . . . . . . . . . . . -0.3v to (v cc +0.3v) short circuit duration y, z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous esd rating . . . . . . . . . . . . . . . . . see specification table recommended operating conditions supply voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5v temperature range . . . . . . . . . . . . . . . . -40c to +85c bus pin common mode voltage range . . . . . -7v to +12v thermal resistance (typical, note 5) ja (c/w) 8 ld soic . . . . . . . . . . . . . . . . . 105 8 ld msop, pdip* . . . . . . . . . . . . 140 10 ld msop . . . . . . . . . . . . . . . . 130 14 ld soic . . . . . . . . . . . . . . . . 130 maximum junction temperature (plastic package) . +150c maximum storage temperature range . . -65c to +150c pb-free reflow profile. . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/pb-freereflow.asp *pb-free pdips can be used for through-hole wave solder processing only. they are not intended for use in reflow solder processing applications. caution: do not operate at or near the maximum ratings listed for extended periods of time. exposure to such conditions may adv ersely impact product reliability and result in failures not covered by warranty. note: 5. ja is measured with the component mounted on a high effective thermal conductivity test board in free air. see tech brief tb379 for details. electrical specifications test conditions: v cc = 4.5v to 5.5v; unless otherwis e specified. typicals are at v cc = 5v, t a =+25c (note6). boldface limits apply over the operating temperature range, -40c to +85c. parameter symbol test conditions temp (c) min (note 14) typ max (note 14) units dc characteristics driver differential v out (no load) v od1 full - - v cc v driver differential v out (loaded) v od2 r l = 100 (rs-422) (figure 1a) full 2.8 3.6 - v r l = 54 (rs-485) (figure 1a) full 2.4 3.1 v cc v r l = 15 (eight 120 terminations) (note 15) 25 - 1.65 - v r l = 60 , -7v v cm 12v (figure 1b) full 2.4 3- v change in magnitude of driver differential v out for complementary output states v od r l = 54 or 100 (figure 1a) full - 0.01 0.2 v driver common-mode v out v oc r l = 54 or 100 (figure 1a) full - - 3.15 v change in magnitude of driver common-mode v out for complementary output states v oc r l = 54 or 100 (figure 1a) full - 0.01 0.2 v logic input high voltage v ih de, di, re full 2 -- v logic input low voltage v il de, di, re full - - 0.8 v di input hysteresis voltage v hys 25 - 100 - mv logic input current i in1 de, di, re full -2 - 2 a input current (a, b, a/y, b/z) i in2 de = 0v, v cc = 0v or 5.5v v in = 12v full - 70 125 a v in = -7v full -75 55 - a isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
6 fn6363.2 july 30, 2009 output leakage current (y, z) (full duplex versions only) i in3 re = 0v, de = 0v, v cc = 0v or 5.5v v in = 12v full - 1 40 a v in = -7v full -40 -9 - a output leakage current (y, z) in shutdown mode (full duplex) i in4 re = v cc , de = 0v, v cc = 0v or 5.5v v in = 12v full - 1 20 a v in = -7v full -20 -9 - a driver short-circuit current, v o = high or low i osd1 de = v cc , -7v v y or v z 12v (note 8) full - - 250 ma receiver differential threshold voltage v th -7v v cm 12v full -200 -90 -50 mv receiver input hysteresis v th v cm = 0v 25 - 20 - mv receiver output high voltage v oh i o = -8ma, v id = -50mv full v cc - 1.2 4.3 - v receiver output low voltage v ol i o = -8ma, v id = -200mv full - 0.25 0.4 v receiver output low current i ol v o = 1v, v id = -200mv full 20 28 - ma three-state (high impedance) receiver output current i ozr 0.4v v o 2.4v full -1 0.03 1 a receiver input resistance r in -7v v cm 12v full 96 160 - k receiver short-circuit current i osr 0v v o v cc full 7 65 85 ma supply current no-load supply current (note 7) i cc half duplex versions, de = v cc , re = x, di = 0v or v cc full - 650 800 a all versions, de = 0v, re = 0v, or full duplex versions, de = v cc , re = x. di = 0v or v cc full - 550 700 a shutdown supply current i shdn de = 0v, re = v cc , di = 0v or v cc full - 0.07 3 a esd performance rs-485 pins (a, y, b, z, a/y, b/z) iec61000-4-2, air-gap discharge method 1/2 duplex 25 - 16.5 - kv full duplex 25 - 10 - kv iec61000-4-2, contact discharge method 25 - 9 - kv human body model, from bus pins to gnd 25 - 16.5 - kv all pins human body model, per mil-std-883 method 3015 25 - 7 - kv machine model 25 - 400 - v electrical specifications test conditions: v cc = 4.5v to 5.5v; unless otherwis e specified. typicals are at v cc = 5v, t a =+25c (note6). boldface limits apply over the operating temperature range, -40c to +85c. (continued) parameter symbol test conditions temp (c) min (note 14) typ max (note 14) units isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
7 fn6363.2 july 30, 2009 driver switching characteristics (115kbps versions; isl3150e, isl3152e) driver differential output delay t plh, t phl r diff = 54 , c l = 100pf (figure 2) full 500 970 1300 ns driver differential output skew t skew r diff = 54 , c l = 100pf (figure 2) full - 12 50 ns driver differential rise or fall time t r , t f r diff = 54 , c l = 100pf (figure 2) full 700 1100 1600 ns maximum data rate f max c d = 820pf (figure 4) (note 17) full 115 2000 - kbps driver enable to output high t zh r l = 500 , c l = 100pf, sw = gnd (figure 3), (note 9) full - 300 600 ns driver enable to output low t zl r l = 500 , c l = 100pf, sw = v cc (figure 3), (note 9) full - 130 500 ns driver disable from output low t lz r l = 500 , c l = 15pf, sw = v cc (figure 3) full - 50 65 ns driver disable from output high t hz r l = 500 , c l = 15pf, sw = gnd (figure 3) full - 35 60 ns time to shutdown t shdn (note 11) full 60 160 600 ns driver enable from shutdown to output high t zh(shdn) r l = 500 , c l = 100pf, sw = gnd (figure 3), (notes 11, 12) full - - 250 ns driver enable from shutdown to output low t zl(shdn) r l = 500 , c l = 100pf, sw = v cc (figure 3), (notes 11, 12) full - - 250 ns driver switching characteristics (1mbps versions; isl3153e, isl3155e) driver differential output delay t plh, t phl r diff = 54 , c l = 100pf (figure 2) full 150 270 400 ns driver differential output skew t skew r diff = 54 , c l = 100pf (figure 2) full - 3 10 ns driver differential rise or fall time t r , t f r diff = 54 , c l = 100pf (figure 2) full 150 325 450 ns maximum data rate f max c d = 820pf (figure 4) (note 17) full 1 8 - mbps driver enable to output high t zh r l = 500 , c l = 100pf, sw = gnd (figure 3), (note 9) full - 110 200 ns driver enable to output low t zl r l = 500 , c l = 100pf, sw = v cc (figure 3), (note 9) full - 60 200 ns driver disable from output low t lz r l = 500 , c l = 15pf, sw = v cc (figure 3) full - 50 65 ns driver disable from output high t hz r l = 500 , c l = 15pf, sw = gnd (figure 3) full - 35 60 ns time to shutdown t shdn (note 11) full 60 160 600 ns driver enable from shutdown to output high t zh(shdn) r l = 500 , c l = 100pf, sw = gnd (figure 3), (notes 11, 12) full - - 250 ns driver enable from shutdown to output low t zl(shdn) r l = 500 , c l = 100pf, sw = v cc (figure 3), (notes 11, 12) full - - 250 ns electrical specifications test conditions: v cc = 4.5v to 5.5v; unless otherwis e specified. typicals are at v cc = 5v, t a =+25c (note6). boldface limits apply over the operating temperature range, -40c to +85c. (continued) parameter symbol test conditions temp (c) min (note 14) typ max (note 14) units isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
8 fn6363.2 july 30, 2009 driver switching characteristics (20mbps versions; isl3156e, isl3158e) driver differential output delay t plh, t phl r diff = 54 , c l = 100pf (figure 2) full - 21 30 ns driver differential output skew t skew r diff = 54 , c l = 100pf (figure 2) full - 0.2 3 ns driver differential rise or fall time t r , t f r diff = 54 , c l = 100pf (figure 2) full - 12 16 ns maximum data rate f max c d = 470pf (figure 4) (note 17) full 20 55 - mbps driver enable to output high t zh r l = 500 , c l = 100pf, sw = gnd (figure 3), (note 9) full - 30 45 ns driver enable to output low t zl r l = 500 , c l = 100pf, sw = v cc (figure 3), (note 9) full - 28 45 ns driver disable from output low t lz r l = 500 , c l = 15pf, sw = v cc (figure 3) full - 50 65 ns driver disable from output high t hz r l = 500 , c l = 15pf, sw = gnd (figure 3) full - 38 60 ns time to shutdown t shdn (note 11) full 60 160 600 ns driver enable from shutdown to output high t zh(shdn) r l = 500 , c l = 100pf, sw = gnd (figure 3), (notes 11, 12) full - - 200 ns driver enable from shutdown to output low t zl(shdn) r l = 500 , c l = 100pf, sw = v cc (figure 3), (notes 11, 12) full - - 200 ns receiver switching characteristics (115kbps an d 1mbps versions; isl3150e through isl3155e) maximum data rate f max (figure 5) (note 17) full 1 12 - mbps receiver input to output delay t plh , t phl (figure 5) full - 100 150 ns receiver skew | t plh - t phl |t skd (figure 5) full - 4 10 ns receiver enable to output low t zl r l = 1k , c l = 15pf, sw = v cc (figure 6), (note 10) full - 9 20 ns receiver enable to output high t zh r l = 1k , c l = 15pf, sw = gnd (figure 6), (note 10) full - 7 20 ns receiver disable from output low t lz r l = 1k , c l = 15pf, sw = v cc (figure 6) full - 8 15 ns receiver disable from output high t hz r l = 1k , c l = 15pf, sw = gnd (figure 6) full - 8 15 ns time to shutdown t shdn (note 11) full 60 160 600 ns receiver enable from shutdown to output high t zh(shdn) r l = 1k , c l = 15pf, sw = gnd (figure 6), (notes 11, 13) full - - 200 ns receiver enable from shutdown to output low t zl(shdn) r l = 1k , c l = 15pf, sw = v cc (figure 6), (notes 11, 13) full - - 200 ns receiver switching characteristics (20mbps versions; isl3156e, isl3158e) maximum data rate f max (figure 5) (note 17) full 20 30 - mbps receiver input to output delay t plh , t phl (figure 5) full - 33 45 ns electrical specifications test conditions: v cc = 4.5v to 5.5v; unless otherwis e specified. typicals are at v cc = 5v, t a =+25c (note6). boldface limits apply over the operating temperature range, -40c to +85c. (continued) parameter symbol test conditions temp (c) min (note 14) typ max (note 14) units isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
9 fn6363.2 july 30, 2009 receiver skew | t plh - t phl |t skd (figure 5) full - 2.5 5 ns receiver enable to output low t zl r l = 1k , c l = 15pf, sw = v cc (figure 6), (note 10) full - 8 15 ns receiver enable to output high t zh r l = 1k , c l = 15pf, sw = gnd (figure 6), (note 10) full - 7 15 ns receiver disable from output low t lz r l = 1k , c l = 15pf, sw = v cc (figure 6) full - 8 15 ns receiver disable from output high t hz r l = 1k , c l = 15pf, sw = gnd (figure 6) full - 8 15 ns time to shutdown t shdn (note 11) full 60 160 600 ns receiver enable from shutdown to output high t zh(shdn) r l = 1k , c l = 15pf, sw = gnd (figure 6), (notes 11, 13) full - - 200 ns receiver enable from shutdown to output low t zl(shdn) r l = 1k , c l = 15pf, sw = v cc (figure 6), (notes 11, 13) full - - 200 ns notes: 6. all currents into device pins are positive; all currents out of device pins are nega tive. all voltages are referenced to devi ce ground unless otherwise specified. 7. supply current specification is vali d for loaded drivers when de = 0v. 8. applies to peak current. see ?t ypical performance curv es? beginning on page 14 for more information. 9. keep re = 0 to prevent the device from entering shdn. 10. the re signal high time must be short enough (typically <100ns) to prevent the device from entering shdn. 11. transceivers are put into shutdown by bringing re high and de low. if the inputs are in this state for less than 60ns, the parts are guaranteed not to enter shutdown. if th e inputs are in this state for at least 600n s, the parts are guaranteed to have ente red shutdown. see ?low power shutdown mode? on page 13. 12. keep re = vcc, and set the de signal low time >600n s to ensure that the device enters shdn. 13. set the re signal high time >6 00ns to ensure that th e device enters shdn. 14. parameters with min and/or max limits are 100% tested at +25c, unless otherwise specified. temperature limits established by characterization and ar e not production tested. 15. see figure 8 for more information, and for performance over-temperature. 16. tested according to tia/eia-485-a, section 4.2.6 (100v for 15s at a 1% duty cycle). 17. limits established by characterizat ion and are not production tested. test circuits and waveforms figure 1a. v od and v oc figure 1b. v od with common mode load figure 1. dc driver test circuits electrical specifications test conditions: v cc = 4.5v to 5.5v; unless otherwis e specified. typicals are at v cc = 5v, t a =+25c (note6). boldface limits apply over the operating temperature range, -40c to +85c. (continued) parameter symbol test conditions temp (c) min (note 14) typ max (note 14) units d de di v cc v od v oc r l /2 r l /2 z y d de di v cc v od 375 375 z y r l = 60 v cm -7v to +12v isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
10 fn6363.2 july 30, 2009 figure 2a. test circuit figure 2b. measurement points figure 2. driver propagation delay and differential transition times figure 3a. test circuit figure 3b. measurement points figure 3. driver enable and disable times figure 4a. test circuit figure 4b. measurement points figure 4. driver data rate test circuits and waveforms (continued) d de di v cc signal generator c l = 100pf r diff z y c l = 100pf out (z) 3v 0v 1.5v 1.5v v oh v ol out (y) t plh t phl diff out (y - z) t r +v od -v od 90% 90% t f 10% 10% di skew = |t plh - t phl | d de di z y v cc gnd sw parameter output re di sw c l (pf) t hz y/z x 1/0 gnd 15 t lz y/z x 0/1 v cc 15 t zh y/z 0 (note 9) 1/0 gnd 100 t zl y/z 0 (note 9) 0/1 v cc 100 t zh(shdn) y/z 1 (note 12) 1/0 gnd 100 t zl(shdn) y/z 1 (note 12) 0/1 v cc 100 signal generator 500 c l out (y, z) 3v 0v 1.5v 1.5v v oh 0v v oh - 0.5v t hz out (y, z) v cc v ol v ol + 0.5v t lz de output high output low t zl , t zl(shdn) t zh , t zh(shdn) note 10 2.3v 2.3v note 10 note 10 d de di v cc signal generator z y c d v od + - 60 3v 0v diff out (y - z) +v od -v od di 0v isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
11 fn6363.2 july 30, 2009 figure 5a. test circuit figure 5b. measurement points figure 5. receiver propag ation delay and data rate figure 6a. test circuit figure 6b. measurement points figure 6. receiver enable and disable times test circuits and waveforms (continued) signal generator r ro re a b 0v 15pf ro +1.5v -1.5v t plh 0v 0v v cc 0v 1.5v 1.5v t phl a 1k v cc gnd sw parameter de a sw t hz 0 +1.5v gnd t lz 0 -1.5v v cc t zh (note 10) 0 +1.5v gnd t zl (note 10) 0 -1.5v v cc t zh(shdn) (note 13) 0 +1.5v gnd t zl(shdn) (note 13) 0 -1.5v v cc signal generator r ro re a b gnd 15pf ro 3v 0v 1.5v 1.5v v oh 0v 1.5v v oh - 0.5v t hz ro v cc v ol 1.5v v ol + 0.5v t lz re output high output low t zl , t zl(shdn) t zh , t zh(shdn) note 10 note 10 note 10 isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
12 fn6363.2 july 30, 2009 application information rs-485 and rs-422 are differential (balanced) data transmission standards used for long haul or noisy environments. rs-422 is a subset of rs-485, so rs-485 transceivers are also rs-422 compliant. rs-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. rs-485 is a true multipoint standard, which allows up to 32 one unit load devices (any combination of drivers and receivers) on each bus. to allow for multipoint operation, the rs-485 specification requires that drivers must handle bus contention without sustaining any damage. another important advantage of rs-485 is the extended common mode range (cmr), which specifies that the driver outputs and receiver inputs withstand signals that range from +12v to -7v. rs-422 and rs-485 are intended for runs as long as 4000?, so the wide cmr is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. receiver (rx) features these devices utilize a differential input receiver for maximum noise immunity and common mode rejection. input sensitivity is better than 200mv, as required by the rs-422 and rs- 485 specifications. rx outputs feature high drive levels (typically 28ma @ v ol = 1v) to ease the design of optically coupled isolated interfaces. receiver input resistance of 96k surpasses the rs-422 specification of 4k , and is eight times the rs-485 ?unit load (ul)? requirement of 12k minimum. thus, these products are known as ?one-eighth ul? transceivers, and there can be up to 256 of these devices on a network while still complying with the rs-485 loading specification. rx inputs function with common mode voltages as great as 7v outside the power supplies (i.e., +12v and -7v), making them ideal for long networks where induced voltages are a realistic concern. all the receivers include a ?full fail-safe? function that guarantees a high level receiv er output if the receiver inputs are unconnected (floating), shorted together, or connected to a terminated bus with all the transmitters disabled. receivers easily meet the data rates supported by the corresponding driver, and all receiver outputs are three-statable via the active low re input. driver (tx) features the rs-485/rs-422 driver is a differential output device that delivers at least 2.4v across a 54 load (rs-485), and at least 2.8v across a 100 load (rs-422). the drivers feature low propagation delay skew to maximize bit width, and to minimize emi, and all drivers are three-statable via the active high de input. the 115kbps and 1mbps driver outputs are slew rate limited to minimize emi, and to minimize reflections in unterminated or improperly terminated networks. outputs of the isl3156e and isl3158e drivers are not limited, so faster output transition times allow data rates of at least 20mbps. high v od improves noise immunity and flexibility the isl315xe driver design delivers larger differential output voltages (v od ) than the rs-485 standard requires, or than most rs-485 transmitters can deliver. the minimum 2.4v v od guarantees at least 900mv more noise immunity than networks built using standard 1.5v v od transmitters. another advantage of the large v od is the ability to drive more than two bus terminations, which allows for utilizing the isl315xe in ?star? and other multi-terminated, ?nonstandard? network topologies. figure 8, details the transmitter?s v od vs i out characteristic, and includes load lines for six (20 ) and eight (15 ) 120 terminations. the figure shows that the driver typically delivers 1.65/1.5v into 6/8 terminations, even at the worst case temperature of +85 c. the rs-485 standard requires a minimum 1.5v v od into two terminations, but the isl315xe delivers rs-485 voltage levels with 3x to 4x the number of terminations. hot plug function when a piece of equipment powers up, there is a period of time where the processor or asic driving the rs-485 control lines (de, re ) is unable to ensure that the rs-485 tx and rx outputs are kept disabled. if the equipment is connected to the bus, a driver activating prematurely during power-up may crash the bus. to avoid this scenario, the isl315xe devices incorporate a ?hot plug? function. circuitry monitoring v cc ensures that, during power-up and power-down, the tx and rx outputs remain disabled, regardless of the state of de and re , if v cc is less than ~3.4v. this gives the processor/asic a chance to stabilize and drive the rs-485 control lines to the proper states. time (40 s/div) vcc receiver output (v) driver y output (v) 2.5 5.0 2.5 5.0 vcc (v) rl = 1k ro 0 2.5 5.0 0 0 a / y rl = 1k 3.3v 3.5v isl315xe isl315xe re = gnd de, di = vcc figure 7. hot plug performance (isl315xe) vs isl83088e without hot plug circuitry isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
13 fn6363.2 july 30, 2009 esd protection all pins on these devices include class 3 (>7kv) human body model (hbm) es d protection structures, but the rs-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive esd events in excess of 16.5kv hbm and 16.5kv (1/2 du plex) iec61000-4-2. the rs-485 pins are particularly vulnerable to esd strikes because they typically connect to an exposed port on the exterior of the finished product. simply touching the port pins, or connectin g a cable, can cause an esd event that might destroy unprotected ics. these new esd structures protect the device whether or not it is powered up, and with out degrading the rs-485 common mode range of -7v to +12v. this built-in esd protection eliminates the need for board level protection structures (e.g., transient suppression diodes), and the associated, undesirable capacitive load they present. iec61000-4-2 testing the iec61000 test method applies to finished equipment, rather than to an individual ic. therefore, the pins most likely to suffer an esd event are those that are exposed to the outside world (the rs-485 pins in this case), and the ic is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. the iec61000 standard?s lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the hbm test. the extra esd protection built into this device?s rs-485 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the rs-485 port. air-gap discharge test method for this test method, a charged probe tip moves toward the ic pin until the voltage arcs to it. the current waveform delivered to the ic pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results. the isl315xe 1/2 duplex rs-485 pins withstand 16.5kv air-gap discharges. contact discharge test method during the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. the result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than 9kv. the rs-485 pins of all the isl315xe versions survive 9kv contact discharges. data rate, cables, and terminations rs-485/rs-422 are intended for network lengths up to 4000?, but the maximum system data rate decreases as the transmission length increases. devices operating at 20mbps are limited to lengths less than 100?, while the 115kbps versions can operate at full data rates with lengths of several 1000?. twisted pair is the cable of choice for rs-485/rs-422 networks. twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ics. proper termination is imperative, when using the 20mbps devices, to minimize reflec tions. short networks using the 115kbps versions need not be terminated, but, terminations are recommended unless power dissipation is an overriding concern. in point-to-point, or point-to-multipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120 ) at the end farthest from the driver. in multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. stubs connecting a transceiver to the main cable should be kept as short as possible. built-in driver overload protection as stated previously, the rs-485 specification requires that drivers survive worst case bus contentions undamaged. these devices meet this requirement via driver output short circuit current limits, and on-chip thermal shutdown circuitry. the driver output stages incorporate short circuit current limiting circuitry which ensure s that the output current never exceeds the rs-485 specification, even at the common mode voltage range extremes. in the event of a major short circuit condition, devices also include a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. this eliminates the power dissipation, allowing the die to cool. the drivers automatically re-enable after the die temperature drops about 15c. if the contention persists, the thermal shutdown/re-enable cycle repeats until the fault is cleared. receivers stay operational during thermal shutdown. low power shutdown mode these cmos transceivers all use a fraction of the power required by their bipolar counterparts, but they also include a shutdown feature that reduces the already low quiescent i cc to a 70na trickle. these devices enter shutdown whenever the receiver and driver are simultaneously disabled (re =v cc and de = gnd) for a period of at least 600ns. disabling both the driver and the receiver for less than 60ns guarantees that the transceiver will not enter shutdown. note that receiver and driver enable times increase when the transceiver enables from shutdown. refer to notes 9, 10, 11, 12 and 13, at the end of the ?electrical specification? table on page 9, for more information. isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
14 fn6363.2 july 30, 2009 typical performance curves v cc = 5v, t a = +25c; unless otherwise specified. figure 8. driver output current vs differential output voltage figure 9. driver differential output voltage vs temperature figure 10. driver output current vs short circuit voltage figure 11. supply current vs temperature figure 12. driver differential propagation delay vs temperature (isl3150e, isl3152e) figure 13. driver differential skew vs temperature (isl3150e, isl3152e) differential output voltage (v) driver output current (ma) 012345 0 10 40 60 80 100 120 140 30 50 70 90 110 130 20 +25c +85c r d = 15 r d = 20 r d = 54 r d = 100 -40 0 50 85 temperature (c) differential output voltage (v) -25 25 75 2.9 3.1 3.2 3.3 3.4 3.5 3.6 3.7 r diff = 54 r diff = 100 3.0 output voltage (v) -7 -6 -4 -2 0 2 4 6 8 10 12 output current (ma) -50 0 50 100 150 200 -100 -200 -150 y or z = high y or z = low -40 0 50 85 temperature (c) i cc (a) -25 25 75 500 540 580 600 620 640 660 520 560 de = vcc, re = x de = gnd, re = gnd -40 0 50 85 temperature (c) -25 25 75 propagation delay (ns) 960 980 985 990 995 1000 1005 1010 tplh tphl 965 970 975 12 9 8 7 6 5 4 -40 0 50 85 temperature (c) skew (ns) -25 25 75 |cross pt. of y and z - cross pt. of y and z | 11 10 isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
15 fn6363.2 july 30, 2009 figure 14. driver differential propagation delay vs temperature (isl3153e, isl3155e) figure 15. driver differential skew vs temperature (isl3153e, isl3155e) figure 16. driver differential propagation delay vs temperature (isl3156e, isl3158e) figure 17. driver differential skew vs temperature (isl3156e, isl3158e) figure 18. driver and receiver waveforms, (isl3150e, isl3152e) figure 19. driver and receiver waveforms, (isl3153e, isl3155e) typical performance curves v cc = 5v, t a = +25c; unless otherwise specified. (continued) -40 0 50 85 temperature (c) -25 25 75 propagation delay (ns) 270 280 282 284 286 288 290 272 274 276 278 -40 0 50 85 temperature (c) skew (ns) -25 25 75 3.5 3.0 2.5 2.0 1.5 1.0 |cross pt. of y and z - cross pt. of y and z | -40 0 50 85 temperature (c) -25 25 75 propagation delay (ns) 17 20 21 22 23 24 18 19 -40 0 50 85 temperature (c) skew (ns) -25 25 75 0.28 0.18 0.16 0.14 0.12 0.10 |cross pt. of y and z - cross pt. of y and z | 0.26 0.24 0.22 0.20 1 4 5 2 3 time (1 s / div) receiver output (v) rdiff = 54 , cl = 100pf 0 5 driver output (v) 0 5 driver input (v) di ro a / y b / z 1 4 5 2 3 time (400ns / div) receiver output (v) rdiff = 54 , cl = 100pf 0 5 driver output (v) 0 5 driver input (v) di ro b / z a / y isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
16 fn6363.2 july 30, 2009 figure 20. driver and receiver waveforms, (isl3156e, isl3158e) figure 21. receiver output current vs receiver output voltage die characteristics substrate potential (powered up): gnd transistor count: 530 process: si gate bicmos typical performance curves v cc = 5v, t a = +25c; unless otherwise specified. (continued) 1 4 5 2 3 time (20ns / div) receiver output (v) rdiff = 54 , cl = 100pf 0 5 driver output (v) 0 5 driver input (v) di ro b / z a / y receiver output voltage (v) receiver output current (ma) 012345 0 10 20 30 50 60 40 voh, +25c voh, +85c vol, +25c vol, +85c isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
17 fn6363.2 july 30, 2009 products intersil corporation is a leader in the design and manuf acture of high-performance analog semiconductors. the company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. intersil's product families address power management and analog signal processing functions. go to www.intersil.com/products for a complete list of intersil product families. *for a complete listing of applications, related documentat ion and related parts, please see the respective device information page on intersil.com: isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e to report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff fits are available from our website at http://rel.intersil.com/reports/search.php revision history the revision history provided is for informat ional purposes only and is believed to be accurate, but not warranted. please go t o web to make sure you have the latest rev. date revision change 6/30/09 fn6363.2 converted to new intersil template. rev 2 changes are as follows: page 1 - introduction was reworded in order to fit graphs. features section by listing only key features. added pe rformance graphs. page 2 - updated ordering information by numb ering all notes and referencing them on each part. added msl note as new standard with link ed parts to device info page. updated pinout name to pin configurations with pi n descriptions following on page 3. page 5 - added boldface limit ve rbiage in elect. spec table an d bolded min and max over-temp limits. page 17 - added revision hi story and products information with all links included. 1/17/08 fn6363.1 added 8 ld pdip to ordering informat ion, pod and thermal resistance. applied intersil standards as follows: updated or dering information with notes for tape and reel reference, pb-free pdip and lead finish. added pb-free reflow link and pb-free note to thermal information. added e8.3 pod. 2/20/07 fn6363.0 cosmetic edit to the isl315xe data sheet, no rev, no date change, no formal per denise scarborough. removed both comma s in this sentence in the fi rst paragraph: "each driver output, and receiver input, is protected against 16.5kv esd strikes without latch-up." 12/14/06 fn6363.0 initial release to web isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
18 fn6363.2 july 30, 2009 isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e mini small outline pl astic packages (msop) notes: 1. these package dimensions are wi thin allowable dimensions of jedec mo-187ba. 2. dimensioning and tolerancing per ansi y14.5m - 1994. 3. dimension ?d? does not include mold flash, protrusions or gate burrs and are measured at datum plane. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e1? does not includ e interlead flash or protrusions and are measured at datum plane. interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. formed leads shall be planar wi th respect to one another within 0.10mm (0.004) at seating plane. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of ?b? dimension at maximum ma terial condition. minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. datums and to be determined at datum plane . 11. controlling dimension: millimeter. converted inch dimen- sions are for reference only. l 0.25 (0.010) l1 r1 r 4x 4x gauge plane seating plane e e1 n 12 top view index area -c- -b- 0.20 (0.008) a b c seating plane 0.20 (0.008) c 0.10 (0.004) c -a- -h- side view b e d a a1 a2 -b- end view 0.20 (0.008) c d e 1 c l c a - h - -a - - b - - h - m8.118 (jedec mo-187aa) 8 lead mini small outline plastic package symbol inches millimeters notes min max min max a 0.037 0.043 0.94 1.10 - a1 0.002 0.006 0.05 0.15 - a2 0.030 0.037 0.75 0.95 - b 0.010 0.014 0.25 0.36 9 c 0.004 0.008 0.09 0.20 - d 0.116 0.120 2.95 3.05 3 e1 0.116 0.120 2.95 3.05 4 e 0.026 bsc 0.65 bsc - e 0.187 0.199 4.75 5.05 - l 0.016 0.028 0.40 0.70 6 l1 0.037 ref 0.95 ref - n8 87 r 0.003 - 0.07 - - r1 0.003 - 0.07 - - 05 o 15 o 5 o 15 o - 0 o 6 o 0 o 6 o - rev. 2 01/03
19 fn6363.2 july 30, 2009 isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e mini small outline pl astic packages (msop) notes: 1. these package dimensions are wi thin allowable dimensions of jedec mo-187ba. 2. dimensioning and tolerancing per ansi y14.5m - 1994. 3. dimension ?d? does not include mold flash, protrusions or gate burrs and are measured at datum plane. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e1? does not includ e interlead flash or protrusions and are measured at datum plane. interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. formed leads shall be planar wi th respect to one another within 0.10mm (.004) at seating plane. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of ?b? dimension at maximum ma terial condition. minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. datums and to be determined at datum plane . 11. controlling dimension: millimeter. converted inch dimen- sions are for reference only l 0.25 (0.010) l1 r1 r 4x 4x gauge plane seating plane e e1 n 12 top view index area -c- -b- 0.20 (0.008) a b c seating plane 0.20 (0.008) c 0.10 (0.004) c -a- -h- side view b e d a a1 a2 -b- end view 0.20 (0.008) c d e 1 c l c a - h - -a - - b - - h - m10.118 (jedec mo-187ba) 10 lead mini small outline plastic package symbol inches millimeters notes min max min max a 0.037 0.043 0.94 1.10 - a1 0.002 0.006 0.05 0.15 - a2 0.030 0.037 0.75 0.95 - b 0.007 0.011 0.18 0.27 9 c 0.004 0.008 0.09 0.20 - d 0.116 0.120 2.95 3.05 3 e1 0.116 0.120 2.95 3.05 4 e 0.020 bsc 0.50 bsc - e 0.187 0.199 4.75 5.05 - l 0.016 0.028 0.40 0.70 6 l1 0.037 ref 0.95 ref - n10 107 r 0.003 - 0.07 - - r1 0.003 - 0.07 - - 5 o 15 o 5 o 15 o - 0 o 6 o 0 o 6 o - rev. 0 12/02
20 fn6363.2 july 30, 2009 isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e small outline plast ic packages (soic) notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e? does not include inte rlead flash or protrusions. interlead flash and protrusions shall not ex ceed 0.25mm (0.010 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. controlling dimension: millimete r. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 o c h 0.25(0.010) b m m m14.15 (jedec ms-012-ab issue c) 14 lead narrow body small outline plastic package symbol inches millimeters notes min max min max a 0.0532 0.0688 1.35 1.75 - a1 0.0040 0.0098 0.10 0.25 - b 0.013 0.020 0.33 0.51 9 c 0.0075 0.0098 0.19 0.25 - d 0.3367 0.3444 8.55 8.75 3 e 0.1497 0.1574 3.80 4.00 4 e 0.050 bsc 1.27 bsc - h 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 l 0.016 0.050 0.40 1.27 6 n14 147 0 o 8 o 0 o 8 o - rev. 0 12/93
21 fn6363.2 july 30, 2009 isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e dual-in-line plastic packages (pdip) c l e e a c e b e c -b- e1 index 12 3 n/2 n area s eating base plane plane -c- d1 b1 b e d d1 a a2 l a 1 -a- 0.010 (0.25) c a m bs notes: 1. controlling dimensions: inch. in case of conflict between english and metric dimensions, the inch dimensions control. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. symbols are defined in the ?mo se ries symbol list? in section 2.2 of publication no. 95. 4. dimensions a, a1 and l are m easured with the package seated in jedec seating plane gauge gs - 3. 5. d, d1, and e1 dimensions do not include mold flash or protru- sions. mold flash or protrusi ons shall not exceed 0.010 inch (0.25mm). 6. e and are measured with the leads constrained to be per- pendicular to datum . 7. e b and e c are measured at the lead tips with the leads uncon- strained. e c must be zero or greater. 8. b1 maximum dimensions do not include dambar protrusions. dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. n is the maximum number of terminal positions. 10. corner leads (1, n, n/2 and n/2 + 1) for e8.3, e16.3, e18.3, e28.3, e42.6 will have a b1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). e a -c- e8.3 (jedec ms-001-ba issue d) 8 lead dual-in-line plastic package symbol inches millimeters notes min max min max a - 0.210 - 5.33 4 a1 0.015 - 0.39 - 4 a2 0.115 0.195 2.93 4.95 - b 0.014 0.022 0.356 0.558 - b1 0.045 0.070 1.15 1.77 8, 10 c 0.008 0.014 0.204 0.355 - d 0.355 0.400 9.01 10.16 5 d1 0.005 - 0.13 - 5 e 0.300 0.325 7.62 8.25 6 e1 0.240 0.280 6.10 7.11 5 e 0.100 bsc 2.54 bsc - e a 0.300 bsc 7.62 bsc 6 e b - 0.430 - 10.92 7 l 0.115 0.150 2.93 3.81 4 n8 89 rev. 0 12/93
22 intersil products are manufactured, assembled and tested utilizing iso9000 qu ality systems as noted in the quality certifications found at www.intersil.com/design/quality intersil products are sold by description only. intersil corporation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, th e reader is cautioned to verify that data sheets are current before placing orders. information furnished by intersil is believed to be accura te and reliable. however, no re sponsibility is assumed by inte rsil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which ma y result from its use. no licen se is granted by implication o r otherwise under any patent or patent rights of intersil or its subsidiaries. for information regarding intersil corporation and its products, see www.intersil.com fn6363.2 july 30, 2009 for additional products, see www.intersil.com/product_tree isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e small outline plast ic packages (soic) index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 c h 0.25(0.010) b m m notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e? does not include in terlead flash or protrusions. inter- lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. controlling dimension: millimete r. converted inch dimensions are not necessarily exact. m8.15 (jedec ms-012-aa issue c) 8 lead narrow body small outline plastic package symbol inches millimeters notes min max min max a 0.0532 0.0688 1.35 1.75 - a1 0.0040 0.0098 0.10 0.25 - b 0.013 0.020 0.33 0.51 9 c 0.0075 0.0098 0.19 0.25 - d 0.1890 0.1968 4.80 5.00 3 e 0.1497 0.1574 3.80 4.00 4 e 0.050 bsc 1.27 bsc - h 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 l 0.016 0.050 0.40 1.27 6 n8 87 0 8 0 8 - rev. 1 6/05

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